发明名称 METAL-FILM-END DETECTING METHOD AND ITS DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a metal-film-end detecting method which uses a high frequency wave that is easy to be built in a platen etc. in a polishing device, its space resolution is high, and certainly detects the polishing end of metal film in high accuracy. <P>SOLUTION: The metal-film-end detecting method uses a high frequency wave with which a predetermined metal film surface 8 is irradiated in a predetermine area so that the irradiated surface crosses the predetermined metal film 8, and which detects the polishing end of the predetermined metal film 8 on the basis of the inflection point which is generated in at least characteristics of either a reflected wave from the predetermined metal film 8, or a transmitted wave transmitted through the predetermined metal film 8 and wafer W. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009049147(A) 申请公布日期 2009.03.05
申请号 JP20070213172 申请日期 2007.08.17
申请人 TOKYO SEIMITSU CO LTD 发明人 NAGAI DAICHI;FUJITA TAKASHI;YOKOYAMA TOSHIYUKI;KITADE KEITA
分类号 H01L21/304;B24B37/013;B24B49/10 主分类号 H01L21/304
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