发明名称 ELECTRONIC EQUIPMENT, AND MANUFACTURING METHOD OF ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide electronic equipment capable of preventing generation of a crack on a protection film.SOLUTION: Electronic equipment in an embodiment includes: a MEMS element 20 provided on a ground region 10; and a protection film 30 including a first layer 31, a second layer 32 provided on the first layer, and a third layer 33 provided on the second layer, covering the MEMS element, and forming a cavity 40 on the inside. The outer periphery of the second layer is positioned further inside than the outer periphery of the cavity from the viewpoint in a direction perpendicular to the surface of the ground region.SELECTED DRAWING: Figure 1
申请公布号 JP2016172291(A) 申请公布日期 2016.09.29
申请号 JP20150052307 申请日期 2015.03.16
申请人 TOSHIBA CORP 发明人 SAITO TOMOHIRO;OBARA KEI
分类号 B81B7/02;B81C1/00;H01G5/014;H01L21/822;H01L23/02;H01L23/10;H01L27/04 主分类号 B81B7/02
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