| 发明名称 | Conductor structure element and method for producing a conductor structure element | ||
| 摘要 | The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed. | ||
| 申请公布号 | US9456500(B2) | 申请公布日期 | 2016.09.27 |
| 申请号 | US201013515012 | 申请日期 | 2010.12.17 |
| 申请人 | SCHWEIZER ELECTRONIC AG | 发明人 | Gottwald Thomas;Neumann Alexander |
| 分类号 | H05K3/30;H05K1/18;H01L21/48;H01L21/56;H01L21/683;H01L23/31;H01L23/538;H01L23/00;H05K3/20;H05K3/42;H05K3/46 | 主分类号 | H05K3/30 |
| 代理机构 | Shlesinger, Arkwright & Garvey LLP | 代理人 | Shlesinger, Arkwright & Garvey LLP |
| 主权项 | 1. A method for producing a conductor structure element, comprising: providing a rigid carrier; electrodepositing a copper coating on the rigid carrier; applying a conductive pattern structure on the copper coating; populating the conductive pattern structure with components; laminating the carrier with at least one electrically insulating layer; removing the rigid carrier by dissolving or etching the rigid carrier; and at least partially removing the copper coating to expose the conductive pattern structure. | ||
| 地址 | Schramberg DE | ||