<p>A molded article of a transparent ABS resin comprising 10 to 24% by weight of a diene type rubber having a weight average particle size of 150 mµ or less and not containing methyl methacrylate in the continuous resin phase is subjected to wet plating. The resulting plated resin article has an excellent adhesion of the plating layer and a good transparency.</p>
申请公布号
EP0153623(A1)
申请公布日期
1985.09.04
申请号
EP19850101250
申请日期
1985.02.06
申请人
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
发明人
MAEDA, TETSURO DENKI KAGAKU KOGYO K. K.;WADA, FUKUAKI DENKI KAGAKU KOGYO K. K.;OHOKA, SUSUMU DENKI KAGAKU KOGYO K. K.;OKAMOTO, AKIHIRO DENKI KAGAKU KOGYO K. K.