| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition useful as a resist for etching or pattern plating in the manufacture of a printed wiring board excellent in resolution, adhesion property of thin lines, stripping property and flexibility or in the precision processing of metal, and to provide a dry film using the composition. <P>SOLUTION: The photosensitive resin composition has 75 to 105 mgKOH/g acid value. The composition is formed into a layer of 35 to 60 μm thickness and hardened by exposing both surfaces of the photosensitive resin composition layer with the exposure light quantity corresponding to the 7-th step in the Stauffer ST-21 step tablet. When the hardened resist is immersed in a 1 wt.% sodium carbonate aqueous solution at 21°C, the resist shows ≤120% initial swelling rate for 30 minutes of immersion, 150 to 200% final swelling rate and ≤130 minutes of immersion period to reach the final swelling rate. The dry film is produced by using the above photosensitive resin composition. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
