发明名称 METHOD FOR CONTROLLING HEATER TEMPERATURE OF HOT STAMPING DEVICE
摘要 PROBLEM TO BE SOLVED: To save on energy consumption. SOLUTION: In the hot stamping device which performs a hot stamping process by heating a stamping part at a hot stamping temperature suited for the hot stamping process by a heater 2, the stamping part is adjusted to a stand-by temperature level which is lower than the hot stamping temperature with the help of a control device 4 for controlling the heater 2.
申请公布号 JP2001232759(A) 申请公布日期 2001.08.28
申请号 JP20000044825 申请日期 2000.02.22
申请人 SANKYO SEIKI MFG CO LTD 发明人 KUROIWA YUKIO
分类号 B41F16/00;(IPC1-7):B41F16/00 主分类号 B41F16/00
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