| 摘要 |
PURPOSE: A mounter head of a surface mounting device is provided to accurately mount a semiconductor device and an electrical part by using a variable pitch. CONSTITUTION: A mounter head absorbs a chip, and mounts the chip to a printed circuit board. A plate(16) can be moved to the right and left side along an X-axis frame. A driving motor(20,56) is installed at an upper end of the plate(16), and has a pulley at one end thereof. A ball screw nut(30) is separated from the driving motor(20,56) by a predetermined distance. A ball screw(28) has a pulley at one end thereof. The ball screw(28) is engaged with the ball screw nut(30), and is moved to the right and to the left. A moving plate(36) is installed on the right side of the plate(16), and can be moved to the right and to the left along the X-axis frame. The other end of the ball screw is inserted to the ball screw nut. A first nozzle assembly(102) and a second nozzle assembly(104) are installed at the lower end of the ball screw nut installed in the plate. A third nozzle assembly(106) and a fourth nozzle assembly(108) are installed at the lower portion of the ball screw nut installed in the moving plate(36).
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