发明名称 RANGE-BASED REAL-TIME SCANNING ELECTRON MICROSCOPE NON-VISUAL BINNER
摘要 A technique to identify non-visual defects, such as SEM non-visual defects (SNVs), includes generating an image of a layer of a wafer, evaluating at least one attribute of the image using a classifier, and identifying the non-visual defects on the layer of the wafer. A controller can be configured to identify the non-visual defects using the classifier. This controller can communicate with a defect review tool, such as a scanning electron microscope (SEM).
申请公布号 WO2017024065(A1) 申请公布日期 2017.02.09
申请号 WO2016US45410 申请日期 2016.08.03
申请人 KLA-TENCOR CORPORATION 发明人 ROY, Hemanta;JAIN, Arpit;YATI, Arpit;MOREAU, Olivier;LOBO, Arun
分类号 G01N21/95;G01N21/88;G01Q30/02 主分类号 G01N21/95
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