| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation member high in heat dissipation effect, which can be used for heat-generating electronic parts itself and the resin moldings.SOLUTION: This heat dissipating member 10 includes: a cured film 14 obtained by curing a resin composition containing a filler 11 composed of orthorhombic silicate minerals and a photocurable resin 13; and a metal plate 15 coated with the cured film 14. This heat dissipating member 10 has excellent heat dissipation effects of preferable efficiency, by virtue of the combination of the metal plate 15 and the cured film 14. Here the "silicate mineral" may be a natural product or an artificial product, including an aluminosilicate mineral or further a silicate compound other than minerals. |
