发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method which enable improvement of a washing degree of a table to which a substrate is attached during polishing and a backing material.SOLUTION: A buff processing module 300A is an apparatus for performing buff processing to a processing object and includes: a buff table 400 including a support surface 402 for supporting the processing object; and a washing mechanism for washing the support surface 402 of the buff table 400 through physical contact.SELECTED DRAWING: Figure 2
申请公布号 JP2016043472(A) 申请公布日期 2016.04.04
申请号 JP20140171841 申请日期 2014.08.26
申请人 EBARA CORP 发明人 YAMAGUCHI KUNIAKI;OBATA ITSUKI;MIZUNO TOSHIO
分类号 B24B37/34;B24B29/00;H01L21/304 主分类号 B24B37/34
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