Curable composition

摘要

Provided are a curable composition and its use. The curable composition has excellent processability, workability and adhesiveness, exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and adhesiveness after curing, has long-lasting durability and reliability even under harsh conditions, and does not cause whitening or surface stickiness. The curable composition can be used as an encapsulant or adhesive material for an optical semiconductor such as an LED.

主权项

1. A curable composition, comprising:
(A) a polyorganosiloxane having an average compositional formula of Formula 1; (B) a polyorganosiloxane which has an average compositional formula of Formula 2 and in which a ratio (Ep/Si) of moles of an epoxy group (Ep) to moles of a silicon atom (Si) is 0.15 or less; and (C) a compound having a hydrogen atom binding to a silicon atom,
(R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d   [Formula 1](R23SiO1/2)e(R22SiO2/2)f(R2SiO3/2)g(SiO4/2)h   [Formula 2] wherein R1's are each independently a monovalent hydrocarbon group, R2's are each independently an epoxy group or a monovalent hydrocarbon group, with the proviso that at least one of R1's is an alkenyl group and at least one of R2's is an alkenyl group and at least one of R2's is an epoxy group; and a is 0 or a positive number, b is a positive number, c is 0 or a positive number, d is 0 or a positive number, b/(b+c+d) is 0.65 or more, e is a positive number, f is 0 or a positive number, g is a positive number, h is 0 or a positive number, and f/(f+g+h) is less than 0.65.