发明名称 TRAY FOR A WAFER WITH TAPE FRAME
摘要 A tray for storing a wafer with a tape frame in a storage container includes a ring-shaped frame, a dicing tape and a semiconductor wafer. The dicing tape is stuck on the rear surface of the ring-shaped frame, and the semiconductor wafer is supported on the dicing tape. The tray has a substantially circular shape and is positioned on the upper side and the lower side of the wafer with tape frame. The front surface of the tray has a flat portion for mounting the wafer, and at least a portion of the outer peripheral portion of the front surface of the tray includes a convex portion. A projecting portion is formed on the rear surface so that the projection portion is positioned outside the outer periphery of the semiconductor wafer of the wafer with the tape frame when the tray is positioned on the wafer with tape frame.
申请公布号 US2015380293(A1) 申请公布日期 2015.12.31
申请号 US201414761837 申请日期 2014.02.07
申请人 ACHILLES CORPORATION 发明人 NISHIJIMA Masayuki
分类号 H01L21/683 主分类号 H01L21/683
代理机构 代理人
主权项 1. A tray for use in storing a wafer with tape frame in a storage container, the wafer with tape frame comprises a ring-shaped frame, a dicing tape and a semiconductor wafer, the dicing tape is stuck on the rear surface of the ring-shaped frame, the semiconductor wafer is supported on the dicing tape, wherein, the tray has a substantially circular shape and is positioned on the upper side and the lower side of the wafer with tape frame; the front surface of the tray has a substantially flat portion for mounting the wafer with tape frame, at least a portion of the outer peripheral portion of the front surface of the tray includes a convex portion; and a projecting portion is formed on the rear surface of the tray so that the projection portion is positioned outside the outer periphery of the semiconductor wafer of the wafer with tape frame when the tray is positioned on the wafer with tape frame.
地址 Tokyo JP
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