| 摘要 |
A device to change a collet and a hood is capable of changing an eject hood ejecting a die from a wafer in a die bonding process, and a collet bonding the die to a substrate. The device includes: a collect storage part storing multiple collets; a hood storage part placed to be adjacent to the collect storage part, and storing multiple eject hoods; a collecting part placed to be adjacent to the collect storage part, and collecting the changed collects and hoods; a first robot delivering the collets to the collecting part by separating the collects from a pickup head, installing the collets in the pickup head by transferring the collets from the collet storage part, delivering the hoods to be installed in an eject body from the hood storage part, and delivering the hoods, separated from the eject body, to the collecting part; and a second robot delivering the hoods to the first robot by separating the hoods from the eject body, and installing the hoods in the eject body by receiving the hoods from the first robot. Therefore, the collets and the hoods are collected and supplied without the suspension of the die bonding process. |
