| 摘要 |
<p>A semiconductor device is provided to reduce the amount of an encapsulation material used and prevent incomplete filling of the encapsulation material and voids. A semiconductor die is mounted on a lead frame(12) and is electrically connected to the lead frame. The semiconductor die and the lead frame are encapsulated by an encapsulation material to form an encapsulation portion(15). At least one encapsulation breakaway portion(16) is formed on a surface of the encapsulation portion. The encapsulation portion has a first flat surface(15a), a second flat surface(15b) opposite to the first surface, and third surfaces(15c) formed in a rectangular shape around the first and second surfaces.</p> |
