发明名称 Method and apparatus for improving force control in wafer scribing
摘要 When scribing a substrate, the precise location of the outer peripheral edge of the substrate on a stage is determined and movement of a scribe tool is controlled to first bring the scribe tool into engagement with the substrate at a location inwardly of the outer peripheral edge of the substrate. After a downwardly directed force of predetermined magnitude exerted by the scribe tool has been attained and stabilized, the scribe tool is moved along the substrate to form a scribe line.
申请公布号 US7807479(B1) 申请公布日期 2010.10.05
申请号 US20070708834 申请日期 2007.02.21
申请人 MICRO PROCESSING TECHNOLOGY, INC. 发明人 LINDSEY, JR. PAUL C.
分类号 H01L21/00 主分类号 H01L21/00
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