RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
摘要
<p>The present invention relates to a rigid flexible printed circuit board and a manufacturing method thereof. The rigid flexible printed circuit board according to the embodiment of the present invention includes a flexible substrate which includes a flexible region and a plurality of rigid regions, a first insulation layer which is formed on the rigid region and covers a part of the flexible region by being extended from the rigid region, a plurality of buildup layers which are formed on the first insulation layer of the rigid region and includes a buildup insulation layer and a circuit pattern. At least one of the buildup layers has a different thickness.</p>
申请公布号
KR20150075841(A)
申请公布日期
2015.07.06
申请号
KR20130164194
申请日期
2013.12.26
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
YU, KYUNG CHUL;KIM, HA IL;KIM, YOUNG MAN;AN, DONG GI