PACKAGE SUBSTRATES AND INTEGRATED CIRCUIT PACKAGES INCLUDING THE SAME

摘要

Packages substrates are provided. The package substrates may include a substrate and a set of leads disposed on the substrate. The set of lead may include a first lead, a second lead and a third lead, which are sequentially disposed along a first direction. Each of the first lead, the second lead and the third lead may extend along a second direction that is different from the first direction. The first lead and the second lead may be spaced apart at a first distance, and the second lead and the third lead may be spaced apart at a second distance that is less than the first distance.

主权项

1. A package substrate comprising:
a substrate including a chip area configured to receive a semiconductor chip; and a first set of leads and a second set of leads disposed on the chip area of the substrate along a first direction, wherein: the first set of leads is disposed directly adjacent to the second set of leads; the first set of leads includes a first lead, a second lead and a third lead, which are sequentially disposed along the first direction; the second set of leads includes a fourth lead, a fifth lead and a sixth lead, which are sequentially disposed along the first direction; a first spacing between the first lead and the second lead is similar to a third spacing between the third lead and the fourth lead; and a second spacing between the second lead and the third lead is less than the first spacing and the third spacing.