PACKAGE SUBSTRATE BASED ON 3D PRINTING, AND MANUFACTURING METHOD THEREOF

摘要

A package substrate based on 3D printing, and manufacturing method thereof; the package substrate comprises insulating layers (1), having a complex three dimensional structure, and packaging layers (2); passive/active electronic devices (3, 4) and an electronic connecting device are buried in the packaging layers (2); the electronic connecting device comprises conducting wires (61, 62), a guide post (5), a bonding pad and the assembly thereof. The package substrate based on 3D printing, and manufacturing method thereof improve the existing package substrates (multilayer printed circuit boards) and the wiring layer manufacturing method thereof, and change the production mode and manufacturing technology of the package substrates (multilayer printed circuit boards).