PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

摘要

First electrode pads formed on one semiconductor package surface include a first reinforcing electrode pad having a surface area larger than that of other first electrode pads. Second electrode pads formed on a printed wiring board on which the semiconductor package is mounted include at least one second reinforcing electrode pad. The second reinforcing electrode pad opposes the first reinforcing electrode pad, and has a surface area greater than that of the other second electrode pads. The first and second electrode pads are connected by solder connection parts. A cylindrical enclosing member encloses an outer perimeter of a solder connection part connecting the first and second reinforcing electrode pads. Increases in the amount of warping of semiconductor devices such as the package substrate and the printed wiring board are suppressed, and the development of solder bridges with respect to adjacent solder connecting parts or adjacent components is reduced.

主权项

1. A printed circuit board, comprising:
a semiconductor package having:
a package substrate having a plurality of first electrode pads arranged on one surface of the semiconductor package, the plurality of first electrode pads includes at least one first reinforcing electrode pad having a surface area larger than a surface area of each of the other first electrode pads; anda semiconductor element mounted on the package substrate; a printed wiring board having a plurality of second electrode pads that is arranged opposing each of the first electrode pads, the semiconductor package is mounted on the printed wiring board and the plurality of second electrode pads includes at least one second reinforcing electrode pad being disposed in a location opposing the at least one first reinforcing electrode pad and having a surface area larger than a surface area of each of the other second electrode pads; a plurality of solder connection parts being configured to connect the plurality of first electrode pads and the plurality of second electrode pads, the plurality of solder connection parts includes a plurality of first solder connection parts and a second solder connection part being configured to connect the at least one first reinforcing electrode pad and the at least one second reinforcing electrode pad; and a cylindrical enclosing member being configured to enclose an outer perimeter of the second solder connection part.