发明名称 METHOD OF FORMING DIELECTRIC LAYER ON THE HIGH MOBILITY SUBSTRATE
摘要 Disclosed is a method for forming a dielectric layer with high quality on a substrate having a higher charge mobility than silicon. A natural oxide film is formed on the substrate, wherein the natural oxide film is modified into a protective insulating film, which is a nitride material, through a plasma nitration process. Subsequently, a dielectric layer is formed on the protective insulating film. Heat treatment with two steps is performed after the dielectric layer is formed. By the heat treatment having two steps performed in succession, the internal defect of the dielectric layer is cured and characteristics of an interface between the protective insulating film and the dielectric layer are improved.
申请公布号 KR20140100210(A) 申请公布日期 2014.08.14
申请号 KR20130013248 申请日期 2013.02.06
申请人 DANKOOK UNIVERSITY CHEONAN CAMPUS INDUSTRY ACADEMIC COOPERATION FOUNDATION 发明人 CHUNG, KWUN BUM;KANG, SUK BONG;PARK, HYUN WOO;YEO, CHANG SOO
分类号 H01L21/31 主分类号 H01L21/31
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