发明名称 SUPPORT STRUCTURE AND PROCESSING UNIT
摘要 PROBLEM TO BE SOLVED: To provide a support structure capable of enhancing in-plane uniformity of thickness of a workpiece.SOLUTION: The support structure supports a workpiece in a processing container structure 42 where predetermined processing is performed by feeding treatment gas from one end toward the other end while containing a plurality of workpieces W. The support structure comprises a top plate 48, a bottom 50, and a plurality of support posts 60 coupling the top plate and the bottom where a plurality of supports 88 supporting the workpieces are formed along the length direction and the pitch of the supports is set to increase from the upstream side toward the downstream side in the flow direction of treatment gas. Consequently, in-plane uniformity of thickness of the workpiece is enhanced.
申请公布号 JP2014132674(A) 申请公布日期 2014.07.17
申请号 JP20140028721 申请日期 2014.02.18
申请人 TOKYO ELECTRON LTD 发明人 ASARI SHINJI;OKADA MITSUHIRO
分类号 H01L21/31;C23C16/458 主分类号 H01L21/31
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