| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a package for electronic device which allows for facilitation of degassing and sealing in a cavity.SOLUTION: A method of manufacturing a package for electronic device comprises a bonding step of bonding a planar lid 92 having an outer peripheral surface 92c connecting the front and back surfaces 92a, 92b, and a base 91 provided with a housing space 14 for housing a gyroscope element 2. The bonding step includes a first bonding step of forming a groove 94, interconnecting the housing space 14 and the outside, in the surface of the lid 92 on the side bonded to the base 91, and bonding a portion excepting the portion corresponding to the groove 94, out of the scheduled bonding part of the base 91 and lid 92, by seam welding, and a second bonding step of bonding the portion corresponding to the groove 94, out of the scheduled bonding part, by energy beam (laser light 98) welding. |
