Method of Automatic Optical Inspection for Detection of Macro Defects of Sub-Pixel Defect Size in Pattern Wafers and Non-Pattern Wafers

摘要

A method of automatic optical self-contained inspection for detection of macro defects of sub-pixel defect size in pattern wafers and non-pattern wafers is based on surface light scattering color-intensity computerized analysis. The method includes setting-up initial calibration and deriving correction data. A wafer image is acquired and rendered and compensated for lighting intensity and optical sensor sensitivity color spectra biases and spatial variances prior to displaying the inspection results.