发明名称 |
STACKED PACKAGE INCLUDING SPACERS AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs. |
申请公布号 |
US2014015129(A1) |
申请公布日期 |
2014.01.16 |
申请号 |
US201314029394 |
申请日期 |
2013.09.17 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM SANG-GEUN;HAN DONG-CHUL;GOH SEOK;KIM JEONG-HOON |
分类号 |
H01L23/498;H01L23/00 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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