MICRO-LINK HIGH-BANDWIDTH CHIP-TO-CHIP BUS

摘要

A chip package includes a micro-link between components disposed on a substrate. The micro-link may be an ultra-short multi-conductor transmission line with shared reference planes that results in a distribution of impedance values. Furthermore, the composite signal traces in the transmission line each can support communication of one symbol at a time by ensuring that multiple reflections reach a substantial fraction of a steady-state value within a symbol time. In this way, the micro-link may facilitate continued scaling of the communication bandwidth between the components with low latency to increase the performance of computer systems that include the chip package.