发明名称 |
METHOD OF GROOVING A CHEMICAL-MECHANICAL PLANARIZATION PAD |
摘要 |
<p>A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)≰(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.</p> |
申请公布号 |
EP2622631(A1) |
申请公布日期 |
2013.08.07 |
申请号 |
EP20110833097 |
申请日期 |
2011.09.29 |
申请人 |
INNOPAD, INC. |
发明人 |
LEFEVRE, PAUL;HSU, OSCAR K.;WELLS, DAVID ADAM;ALDEBORGH, JOHN ERIK;JIN, MARC C.;WU, GUANGWEI;MATHEW, ANOOP |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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