发明名称 |
Semiconductor die package and method for making the same |
摘要 |
A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.
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申请公布号 |
US8497164(B2) |
申请公布日期 |
2013.07.30 |
申请号 |
US201213548250 |
申请日期 |
2012.07.13 |
申请人 |
JEREZA ARMAND VINCENT C.;CALO PAUL ARMAND;CRUZ ERWIN VICTOR R.;FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
JEREZA ARMAND VINCENT C.;CALO PAUL ARMAND;CRUZ ERWIN VICTOR R. |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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