发明名称 CONDUCTIVE PATH STRUCTURE AND WIRE HARNESS
摘要 A conductive path structure includes a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, and a semi-solid state insulation member that is in a semi-solid state and covers the cut-off facilitating portion. When the cut-off facilitating portion is cut off so as to separate the first conductive portion and the second conductive portion to each other due to an impact applied to the cut-off facilitating portion, the semi-solid state insulation member covers end portions of the separated first conductive portion and the separated second conductive portion which are close to the cut-out facilitating portion.
申请公布号 EP2617041(A1) 申请公布日期 2013.07.24
申请号 EP20110770186 申请日期 2011.09.16
申请人 YAZAKI CORPORATION 发明人 ADACHI, HIDEOMI;KUBOSHIMA, HIDEHIKO
分类号 H01B7/32;B60K28/14 主分类号 H01B7/32
代理机构 代理人
主权项
地址
您可能感兴趣的专利