| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip mounting device and a chip mounting method. <P>SOLUTION: According to the present invention, a chip mounting device comprises: a first chip mounter on which a working panel with plural arrayed substrate units is loaded, and that has a first feeder station for mounting an entire chip on some of the plural substrate units; a rotary unit rotating the working panel in which a step for mounting a chip to some of the substrate units by the first feeder station is completed; a second chip mounter on which the working panel is loaded, and in which a chip is entirely mounted to the remaining substrate units of the plural substrate units. Also, a chip mounting method is provided. According to the present invention, a process time for recognizing failure of the plural substrate units arrayed on the working panel and mounting the chip can be reduced to improve productivity of a product. <P>COPYRIGHT: (C)2013,JPO&INPIT |
