发明名称 FORMING AIR GAPS IN MEMORY ARRAYS AND MEMORY ARRAYS WITH AIR GAPS THUS FORMED
摘要 Methods of forming air gaps in memory arrays and memory arrays with air gaps thus formed are disclosed. One such method may include forming an isolation region, having a first dielectric, through a charge-storage structure that is over a semiconductor, the isolation region extending into the semiconductor; forming a second dielectric over the isolation region and charge-storage structure; and forming an air gap in the isolation region so that the air gap passes through the charge-storage structure and so that a thickness of the first dielectric is between the air gap and the second dielectric.
申请公布号 US2013026600(A1) 申请公布日期 2013.01.31
申请号 US201113192763 申请日期 2011.07.28
申请人 MICRON TECHNOLOGY, INC.;MATTHEW JAMES;HALLER GORDON;WEIMER RONALD A.;HOPKINS JOHN;SHAMANNA VINAYAK K.;SAPRA SANJEEV 发明人 MATTHEW JAMES;HALLER GORDON;WEIMER RONALD A.;HOPKINS JOHN;SHAMANNA VINAYAK K.;SAPRA SANJEEV
分类号 H01L29/06;H01L21/764 主分类号 H01L29/06
代理机构 代理人
主权项
地址