发明名称 |
POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other.
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申请公布号 |
US2013009290(A1) |
申请公布日期 |
2013.01.10 |
申请号 |
US201113247603 |
申请日期 |
2011.09.28 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD.;LIM CHANG HYUN;LEE YOUNG KI;KIM KWANG SOO;CHOI SEOG MOON |
发明人 |
LIM CHANG HYUN;LEE YOUNG KI;KIM KWANG SOO;CHOI SEOG MOON |
分类号 |
H01L25/065;H01L21/98 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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