A manufacturing method of Heat-pressed micro heat spreader based metal substrate

摘要

PURPOSE: A heat pressure spreader based metal board manufacturing method is provided to prevent the degradation of heat transference efficiency in a printed circuit pattern formation process by promoting a process which forms a printed circuit pattern on a heat spreader. CONSTITUTION: An art work film is formed(ST1). Heat medium acceptance dent unit and an injection needle acceptance dent unit are formed(ST2). A heat pressure heat spreader is formed(ST3). The surface of a heat spreader is washed(ST4). An insulation layer is formed on the surface of the heat spreader(ST5). A copper thin film layer is formed on the insulation layer of the heat spreader(ST6). A heat spreader including the copper thin film layer is pressured and heated(ST7). A path hole or a volt fastening hole is processed on the heat spreader including the copper thin film layer(ST8). A desired wiring pattern is transferred on the copper thin film layer(ST9). A copper thin film wiring pattern is formed using etching solution(ST10). A solder mask layer is formed for protecting a PCB(Printed Circuited Board) pattern(ST11). Thermal medium is injected through an injection needle(ST12). [Reference numerals] (ST1) Art work; (ST10) Etching; (ST11) Formation of a solder mask layer; (ST12) Vacuum injection of a thermal medium; (ST13) Thermal compression sealing and cutting of an injection needle; (ST2) Formation of channel and injection needle receiving grooves; (ST3) Thermal pressing of upper and lower plates; (ST4) Surface washing and drying; (ST5) Formation of an insulation layer; (ST6) Formation of a copper thin film layer; (ST7) Heating and compression molding; (ST8) Hole processing; (ST9) Formation of a desired image