PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to stably perform a plating process by electrically connecting a pad and a via for plating a recognition mark using an additional plated lead line. CONSTITUTION: A base substrate includes a first plating lead line(120) on one side thereof. An insulating layer(130) is formed on the base substrate. One side of the insulating layer contacts the base substrate. A second plating lead line(140) and a pad(150) are formed on the other side of the insulating layer. A via(160) electrically connects the pad and the first plating lead line.