发明名称 LIGHT-EMITTING ELEMENT ARRAY
摘要 PURPOSE: A light emitting element array is provided to increase heat dissipation by forming a heat radiation hole corresponding to a hole formed in a connection pattern and a heat radiation pattern on the lower side of the heat radiation hole. CONSTITUTION: A printed circuit board(120) includes a base substrate, a copper foil pattern and an insulating member. The copper foil pattern includes an electrode pattern and a connection pattern connecting a space between electrode patterns. First to sixth light emitting element packages(111-116) are mounted on the printed circuit board. The electrode pattern and the connection pattern connect the first to sixth light emitting element packages. A heat radiation hole is formed on a base substrate to correspond to a hole.
申请公布号 KR20120073931(A) 申请公布日期 2012.07.05
申请号 KR20100135858 申请日期 2010.12.27
申请人 LG INNOTEK CO., LTD. 发明人 JANG, SUNG WOO;JIN, HONG BOEM
分类号 H01L33/48;H01L33/64 主分类号 H01L33/48
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