发明名称 |
LIGHT-EMITTING ELEMENT ARRAY |
摘要 |
PURPOSE: A light emitting element array is provided to increase heat dissipation by forming a heat radiation hole corresponding to a hole formed in a connection pattern and a heat radiation pattern on the lower side of the heat radiation hole. CONSTITUTION: A printed circuit board(120) includes a base substrate, a copper foil pattern and an insulating member. The copper foil pattern includes an electrode pattern and a connection pattern connecting a space between electrode patterns. First to sixth light emitting element packages(111-116) are mounted on the printed circuit board. The electrode pattern and the connection pattern connect the first to sixth light emitting element packages. A heat radiation hole is formed on a base substrate to correspond to a hole. |
申请公布号 |
KR20120073931(A) |
申请公布日期 |
2012.07.05 |
申请号 |
KR20100135858 |
申请日期 |
2010.12.27 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
JANG, SUNG WOO;JIN, HONG BOEM |
分类号 |
H01L33/48;H01L33/64 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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