| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a piezoelectric device that reduces the contact between a wiring pattern for electroplating, which is exposed while protruding from a side surface of an element mounting member, and a transfer jig and improves the productivity of the piezoelectric device. <P>SOLUTION: A manufacturing method of a piezoelectric device includes: a wiring pattern for electroplating removal process in which a wiring pattern for electroplating 113, which is exposed while protruding from a side surface of an element mounting member 110, is removed with a laser; a piezoelectric vibration element mounting process in which a piezoelectric vibration element 120 is mounted on an element mounting member 110 with a conductive adhesive DS; a piezoelectric vibration element fixing process in which the conductive adhesive DS is heated and cured and a piezoelectric vibration element mounting pad 111 is conductively fixed to the piezoelectric vibration element 120; and a lid member joining process in which a lid member 130 is joined to the element mounting member 110. <P>COPYRIGHT: (C)2012,JPO&INPIT |
