| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding wire or bump wire with a remarkable improvement in attraction of palladium and copper by eliminating factors hindering adhesion between palladium plating and a copper core material surface, and by stably forming a palladium coating on the copper core material surface. <P>SOLUTION: In the bonding wire in which a core material 1 composed mainly of copper is subjected to palladium plating 2, a maximum diameter of voids existing in the vicinity of a copper core material interface below a palladium coating layer is 60 nm or less, and the number of voids having a maximum diameter of 10 nm or more which exist per 1 μm of the coating length is 0.6 or less on average. <P>COPYRIGHT: (C)2012,JPO&INPIT |
