| 摘要 |
In an embodiment of the present invention there is provided a micro-electromechanical (MEMS) accelerometer, including a substrate, a first sensor and a second sensor. The first sensor is configured to measure an acceleration along a first axis parallel to a plane of the substrate. The second sensor is configured to measure an acceleration along an axis perpendicular to the plane of the substrate. The second sensor comprises a first beam, a second beam and a single support structure. The single support structure supports the first and second beams relative to the substrate, wherein the first and second beams circumscribe the first sensor. In another embodiment, the MEMS accelerometer can include a third sensor configured to measure the acceleration along the axis perpendicular to the plane of the substrate. A MEMS accelerometer according to an embodiment of the invention can be insensitive to changes in temperature and/or stresses imposed on the packaging unit. |
