| 摘要 |
A vapor chamber comprises a flat metal tube formed of a circular metal tube by pressing, a powder sintering portion disposed on the inner wall of the metal tube, a supporting structure disposed in and surrounded by the metal tube, a working fluid filled in the metal tube; wherein the top and bottom sides of the metal tube are flat, the two opposite sides connecting the top and bottom sides are seamlessly circular arc shaped, and the other two opposite sides are the sealed ends formed of the two open ends by pressing and sealing. The present invention provides a vapor chamber for CPU, GPU, LED solar cell or other high heat producing electronic products to solve the heat dissipation issues.
|
