| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a composition for a thermosetting silicone resin excellent in handleability, light resistance and heat resistance, and capable of forming the half-setting status which allows encapsulation processing of a photo-semiconductor element. <P>SOLUTION: The composition for a thermosetting silicone resin comprises: (1) a dual-end silanol type silicone oil; (2) an alkenyl group-containing dialkoxyalkylsilane; (3) an organohydrogensiloxane; (4) a condensation catalyst; and (5) a hydrosilylation catalyst. The composition is led to a resin in the half-setting status by condensation-reacting components having condensation reaction functional groups, and then a finally cured resin can be prepared by inducing an addition reaction. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
