| 发明名称 |
STACKED DIE IN DIE BGA PACKAGE |
| 摘要 |
<p>A stacked die assembly is disclosed which eliminates the need for the spacer between stacked dies that allowing clearance for the bonding leads/wires to the substrate. A first die 42 is positioned on a substrate 44 with a second die 46 positioned on top. The underside perimeter of the second die is recessed 63 to allow a clearance for the bonding wires 50a. Figure No. 4</p> |
| 申请公布号 |
SG170615(A1) |
申请公布日期 |
2011.05.30 |
| 申请号 |
SG20070007107 |
申请日期 |
2002.01.09 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
TAN, HOCK CHUAN;LIM, THIAM CHYE;TAN, VICTOR CHER KHNG;NEO, CHEE PENG;TAN, MICHAEL KIAN SHING;CHEW, BENG CHYE |
| 分类号 |
(IPC1-7):H01L21/60;H01L25/065;H01L23/49 |
主分类号 |
(IPC1-7):H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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