发明名称 |
Methods and Systems For Adjusting Operation Of A Wafer Grinder Using Feedback from Warp Data |
摘要 |
Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.
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申请公布号 |
US2011045740(A1) |
申请公布日期 |
2011.02.24 |
申请号 |
US20100891357 |
申请日期 |
2010.09.27 |
申请人 |
MEMC ELECTRONIC MATERIALS, INC. |
发明人 |
BHAGAVAT SUMEET S.;VANDAMME ROLAND R.;KOMURA TOMOMI;KANEKO TOMOHIKO;KAZAMA TAKUTO |
分类号 |
B24B49/00 |
主分类号 |
B24B49/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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