摘要 |
According to the present invention, provided is a method of manufacturing a electronic device including forming a film over a substrate, performing a photoresist over the film, performing a first exposure by using an exposure mask which includes a scribe region and a inspection mark formed in a first side of the scribe region, and performing a second exposure so that a region that is exposed to the first side in the first exposure is exposed to a second side of the scribe region which is opposite to the first side, wherein, in the second exposure, an exposure light is incident on a region where the inspection mark is projected in the first exposure.
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