| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure for mounting an electronic component, which improves a bonding strength between a bump electrode and a substrate-side terminal, improves the reliability of a conductive connection state and allows easy manufacture. <P>SOLUTION: The bump electrode 12 includes base resin 13 arranged on an active face 121a of the electronic component 121 and a conductive film 14 which covers part of a surface of base resin 13, exposes a remaining part and performs conduction to an electrode terminal 16 installed on the active face 121a. Base resin 13 includes an opening 13b surrounding a plurality of electrode terminals 16, a connection 13A whose one end is connected to the electrode terminal 16 and on which part of the conductive film 14 pulled out to the surface is disposed and an adhesion part 13a which is formed in a region except for the opening 13b and the connection 13A and is bonded to a substrate. The base resin 13 is elastically deformed in the connection 13A. Thus, the adhesion part 13a is bonded to the substrate, and the conductive film 14 and the terminal on the substrate are kept in a connection state. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
