| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for electronic component storage whose inside can be held airtight even in a high-pressure atmosphere and enables an electronic component to operate normally, or an electronic device. SOLUTION: The package for electronic component storage includes a ceramic base 1 having a recessed portion 1e where the electronic component 3 is stored on an upper principal surface, a connection pad 1b provided in the recessed portion 1e, and connection conductors 1a, 1c and 1b formed from the connection pad 1b to outside the ceramic base 1. The recessed portion 1e includes a circular or elliptic bottom surface and also includes a step surface 1d where the inside connection pad 1b is arranged above the bottom surface. COPYRIGHT: (C)2009,JPO&INPIT
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