| 摘要 |
A communication module is provided to improve a heat conduction structure between integrated electronic elements on a board, thereby preventing damage to an adjacent element and maintaining a stable circuit operation. A communication module(100) comprises a plurality of electric elements (105,110,115,120,125,130,135,140,145,150,155,160,165,170,175,180,185), a circuit pattern and a heat sink. The electric elements are integrated in one board. The circuit pattern is formed in the board. And the circuit pattern electrically connects the electric elements. The heat sink is formed between the electric element and the circuit pattern or between circuit patterns.
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