| 摘要 |
PROBLEM TO BE SOLVED: To effectively grind a metallic layer which is a plated layer prepared by plating a semiconductor wafer in a process for manufacturing at least one of MEMS devices with copper without causing clogging not like a conventional cup wheel diamond gringing tool. SOLUTION: This device is provided with the semiconductor wafer W chucked by a chuck plate 4 so as to be ground, and a fly cutter blade 10 on the lower surface of a fly cutter plate 9. An air bearing 11 is interposed between a spindle casing 7 and a spindle shaft 8, and one or two of inner fly cutter blades 10b and 10c having the same or a slightly higher height than that of an outer fly cutter blade 10a is annularly provided in the fly cutter blade 10, and the metallic layer M formed in the process for manufacturing at least one of MEMS devices with the semiconductor wafer W is ground. COPYRIGHT: (C)2009,JPO&INPIT
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