| 摘要 |
PROBLEM TO BE SOLVED: To recognize a chip of interest when the chip reaches an object chip even if a plurality of chips are not successively arranged. SOLUTION: A wafer sheet is moved by a specified distance (S1), and whether or not the chip is present in a recognition area is determined (S2). When the chip is not present, lighting is made bright (S4), an image in the recognition area 71 is acquired (S5), thereafter an illuminating device 51 is changed to normal brightness (S6), and the acquired image is analyzed. In this case, a hole made by a sticking needle left in the recognition area is pattern-matched with a registered trace image, thereby obtaining the center position of the chip located at a region of interest from the center of the trace image (S7), the wafer sheet is moved so that the center position coincides with the center of a pickup position for position correction (S8), and the position is used as a reference position for the next motion. COPYRIGHT: (C)2009,JPO&INPIT
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