| 摘要 |
The invention concerns a method of electrical connection between a first component ( 10 ) comprising, on one face, a series of first pads ( 8 ) and a series of hard conductive points ( 13 ) and a second component ( 11 ) comprising, on one face, a series of second pads ( 9 ) and a series of ductile conductive bumps ( 14 ), in which one places opposite each other the two faces and one brings them together in such a way that the points ( 13 ) can penetrate into said bumps ( 14 ), in which the bumps are buried. The invention further concerns a component equipped with a series of buried ductile conductive bumps.
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