| 摘要 |
A semiconductor device includes a substrate, on which an element region and a peripheral region are defined. At least one function element is to be provided in the element region, and the peripheral region surrounds the element region. The semiconductor device also includes a layer of wiring. The semiconductor device also includes a seal ring having a ring portion that is provided in the peripheral region in the same layer as the wiring layer. The ring portion has a main body surrounding a chip region, and a plurality of portions protruding toward the element region from the seal ring main body.
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