发明名称 RESIN MOLD DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a resin mold device which inspects efficiently the position of a target part immediately before the resin molding. SOLUTION: The resin mold apparatus 10 has: a camera 50 photographing the area of a lead frame LF on which a to-be-molded part MB is mounted; an origin setting mechanism 52B setting the origin of the system of coordinates in a photographed image during photographing an image; a target part center coordinate calculating means 52B which calculates the coordinates of the center of the to-be-molded part MB; a unit frame origin coordinate calculating means 52B calculating the coordinates of at least one specified points in a unit frame; a deviation calculating means 52B calculating a deviation of the center of the target part with respect to the coordinates of the origin in a unit frame; and an operation stopping means 52B stopping operation of the resin mold apparatus 10 when the deviation becomes greater than the allowance for the deviation stored preliminarily in a storage device 52A. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008132726(A) 申请公布日期 2008.06.12
申请号 JP20060322099 申请日期 2006.11.29
申请人 APIC YAMADA CORP 发明人 KANAI EIJI
分类号 B29C45/76;B29C45/84 主分类号 B29C45/76
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